Discover unparalleled comfort with the "ТЕП" CLOUD TOUCH SILK duvet (180x210)—your perfect companion for healthy, restorative sleep.
- Filling: An innovative combination of 70% soy fiber and 30% DoubleAir polyester fiber provides exceptional comfort and thermoregulation. Soy fiber is known for its hypoallergenic properties and softness, while DoubleAir technology creates an optimal microclimate, providing a feeling of freshness and coolness.
- Who it is for: This duvet is ideal for those who value a feeling of lightness and coolness during sleep, especially in the ТЕП season or if you tend to overheat at night. Thanks to its hypoallergenic filling, it is an excellent choice for people with sensitive skin and a tendency toward allergies.
- Benefits:
- Hypoallergenic: The filling is safe for everyone and does not cause irritation or allergic reactions.
- Exceptional softness: The soft filling provides maximum comfort, promoting deep and restorative sleep.
- Ideal microclimate: Double Air technology with a double membrane effectively regulates moisture and maintains a comfortable body temperature, adapting to your individual needs.
- Cooling effect: The “breathable” fabric and filling provide a feeling of freshness, preventing overheating.
- Even distribution: The filling does not clump, preserving the duvet’s volume and fluffiness. A gentle shake restores its original appearance.
- Anatomical design: The duvet gently follows the contours of your body, ensuring maximum relaxation.
- Easy care: It can be easily machine-washed at up to 40°C and dries quickly while retaining all its properties. Do not bleach. Drying in the shade or at a low temperature is recommended.
- Manufacturing: Made in Ukraine in compliance with high European quality standards, with care for your healthy sleep.
Size: 180x210 cm, ideal for a double bed.
Color: Classic white.
Packaging: A practical tube bag, convenient for storage and transportation.
Choose the "ТЕП" CLOUD TOUCH SILK duvet for unparalleled comfort and restorative sleep every night.
